In:
International Symposium on Microelectronics, IMAPS - International Microelectronics Assembly and Packaging Society, Vol. 2012, No. 1 ( 2012-01-01), p. 001221-001228
Abstract:
In this study, the electrical performance of a general TSV structure for high-frequency 3D IC integration applications is investigated. Emphasis is placed on the proposal of an analytical model and the analytical equations of a TSV with all its key parameters. Also, the model and equations are verified, both in the frequency and time domains, by more detailed finite element analyses. Finally, a TSV electrical design guideline is proposed.
Type of Medium:
Online Resource
ISSN:
2380-4505
DOI:
10.4071/isom-2012-THP63
Language:
English
Publisher:
IMAPS - International Microelectronics Assembly and Packaging Society
Publication Date:
2012