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Reliability Evaluation for Integrated Glass Interposer

Lee, Ching-Kuan ; Wang, Jen-Chun ; Chang, Hsiang-Hung ; [et al.]

Japan Institute of Electronics Packaging ; 2016

In: Transactions of The Japan Institute of Electronics Packaging Vol. 9, No. 0 ( 2016), p. E16-009-1-E16-009-5

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In: Transactions of The Japan Institute of Electronics Packaging, Japan Institute of Electronics Packaging, Vol. 9, No. 0 ( 2016), p. E16-009-1-E16-009-5

Type of Medium: Online Resource

ISSN: 1883-3365 , 1884-8028

URL: Article

DOI: 10.5104/jiepeng.9.E16-009-1

Language: English

Publisher: Japan Institute of Electronics Packaging

Publication Date: 2016

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Kooperativer Bibliotheksverbund

Berlin Brandenburg