UID:
almafu_9959328968002883
Umfang:
1 online resource (xxv, 766 pages) :
,
illustrations
ISBN:
0470007796
,
9780470007792
,
047000780X
,
9780470007808
Inhalt:
Various social and environmental reasons drive the push to lead-free technologies. Proposed and enacted legislation in the form of international and national laws and standards and local initiatives seem to control the use of lead in electronics manufacture and waste minimization. This book examines all issues, technical, social, historical as well as legislative, related to the current situation and future plans for lead-free electronics. 160; It was originally published by the160;authors for internal purposes but160;has since been updated and taken off the market. 160; These updates include the latest data on cyclic thermo-mechanical deformation properties of lead-free SnAgCu alloys and the comparison of the properties between the standard Sn-Pb and lead-free alloys using the energy partitioning approach. 160; Tin whiskering, solder joint reliability, and lead-free implementation are also covered.
Anmerkung:
Cover -- Contents -- Preface -- Editors -- Contributors -- Acknowledgments -- Chapter 1 Lead-free Electronics: Overview -- 1.1 What Is Lead-free? -- 1.2 Why Lead-free? -- 1.3 Who Are the First Consumers for Lead-free Products? -- 1.4 Are There Any Technical Barriers to Lead-free Electronics? -- 1.5 How Will We Migrate to Lead-free Electronics? -- 1.6 When Will Lead-free Products Be Widely Available? -- 1.7 summary -- 1.8 References -- Chapter 2 Lead-free Legislations, Exemptions, and Compliance -- 2.1 Overview of the Lead-free Legislation -- 2.2 Exemptions -- 2.3 Impact of Exemptions -- 2.4 Compliance with the Legislation -- 2.5 Recommendations and Conclusions -- 2.6 References -- Chapter 3 Lead-free Alloys: Overview -- 3.1 Lead-Free Alloys Requirements -- 3.2 Binary Alloys -- 3.3 Ternary and Quaternary Alloys -- 3.4 Summary -- 3.5 References -- Chapter 4 Lead-free Manufacturing -- 4.1 Introduction -- 4.2 Alloy Selection -- 4.3 Alloy Selection for Wave Soldering -- 4.4 Characteristics of Selected Tin-Silver-Copper Alloy -- 4.5 Considerations and Tests for Lead-free Components -- 4.6 Assuring Material Readiness for Lead-free Assembly -- 4.7 Tracing Lead-free Systems -- 4.8 Solder Paste Handling -- 4.9 Surface-Mount Assembly Process -- 4.10 Wave Solder Process -- 4.11 Rework -- 4.12 Inspection and Testing -- 4.13 Defect Analysis (Pareto) -- 4.14 Lead-free Manufactured Products by Solectron -- 4.15 Conclusions -- 4.16 References -- Chapter 5 Review of Lead-free Solder Joint Reliability -- 5.1 Introduction -- 5.2 Thermal Fatigue and Thermal Cycling Durability -- 5.3 Cyclic Mechanical Stress and Vibration-Inducted Solder Joint Fatigue and Solder Joint Durability -- 5.4 Lead-Free Solder Degradation due to Temperature Ageing and Intermetalllic Compound Formation -- 5.5 Electromigration and Tests with Elevated Temperature and Humidity Conditions -- 5.6 Low-temperature Effect on Soldek Joint Reliability and Tin Pest of Lead-free Solders -- 5.7 Long-term Reliability of Lead-free Solders and Tests with Combined Loading Conditions -- 5.8 Constitutive Characteristics -- Appendix A. Summary of Studies on Lead-free Solder Reliability -- 5.9 References -- Chapter 6 Constitutive Properties and Durability of Selected Lead-free Solders -- 6.1 Introduction -- 6.2 Constitutive Properties -- 6.3 Non-unified Constitutive Model -- 6.4 Unified Constitutive Model -- 6.5 Thermal Cycling Durability -- 6.6 Test Specimen -- 6.7 Constitutive Behavior -- 6.8 Isothermal Mechanical Durability -- 6.9 Thermo-Mechanical Durability -- 6.10 Summary -- 6.11 References -- Chapter 7 Interfacial Reactions and Performance of Lead-free solder Joints -- 7.1 Metallurgical Reactions of Lead-free Solder and Metals -- 7.2 Mechanical Properties of Solders and Solder Joints -- 7.3 Electromigration and Current Carrying Capability -- 7.4 Summary -- 7.5 References -- Chapter 8 Conductive Adhesives -- 8.1 Motivation for Using Conductive Adhesives -- 8.2 Fundamentals about Conductive Adhesives -- 8.3 Materials -- 8.4 ACA Bonding Process Description -- 8.5 Reliability -- 8.6 Key Applications.
Weitere Ausg.:
Print version: Lead-free electronics. Hoboken, N.J. : Wiley-Interscience, ©2006 ISBN 0471786179
Sprache:
Englisch
Schlagwort(e):
Electronic books.
;
Electronic books.
;
Electronic books.
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/047000780X
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/047000780X
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/047000780X
