UID:
almahu_9948025236702882
Umfang:
1 online resource (313 p.)
Ausgabe:
First edition.
ISBN:
1-4557-3151-X
Serie:
Micro & Nano Technologies Series
Inhalt:
To provide an interdisciplinary readership with the necessary toolkit to work with micro- and nanofluidics, this book provides basic theory, fundamentals of microfabrication, advanced fabrication methods, device characterization methods and detailed examples of applications of nanofluidics devices and systems. Case studies describing fabrication of complex micro- and nanoscale systems help the reader gain a practical understanding of developing and fabricating such systems. The resulting work covers the fundamentals, processes and applied challenges of functional engineered nanofluidic syst
Anmerkung:
Description based upon print version of record.
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Front Cover; Nanofluidics and Microfluidics; Copyright Page; Contents; Preface; About the Authors; Acknowledgments; Nomenclature List; Symbols; Common Abbreviations; 1 Introduction; 1.1 Length scales; 1.2 Scope and layout of the book; 1.3 Future outlook; References; Select Bibliography; 2 Fundamentals for Microscale and Nanoscale Flows; 2.1 Introduction; 2.2 Definition of a fluid; 2.3 Pressure-driven flows; 2.4 Low Reynolds number flows; 2.5 Electrokinetic phenomena; 2.6 The electric double layer; 2.7 Debye length; 2.8 Electrokinetic phenomena: revisited
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2.9 Coupling species transport and fluid mechanics2.10 Numerical simulations and advanced modeling methods; References; Select bibliography; 3 Interfaces in Microfluidic and Nanofluidic Systems; 3.1 Introduction; 3.2 Introduction to surfaces; 3.3 Surface charge; 3.4 Surface energy; 3.5 Thermodynamics of surfaces; 3.5.1 Formation of surface layers; 3.5.2 Surface modification methods; 3.5.2.1 Physical methods; 3.5.2.2 Chemical methods; 3.6 Surface characterization methods with relevance to microfluidics and nanofluidics; 3.6.1 Indirect methods; 3.6.2 Direct methods
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3.7 Surface tension-driven flows3.8 Device interfaces; References; Select bibliography; 4 Advanced Fabrication Methods and Techniques; 4.1 Introduction to micro- and nanofabrication; 4.1.1 Patterning-photolithography; 4.1.1.1 Photolithography overview; 4.1.1.1.1 Wafer cleaning and substrate preparation; 4.1.1.1.2 Photoresist application; 4.1.1.1.3 Soft bake; 4.1.1.1.4 Exposure; 4.1.1.1.5 Development, descum, and removal; 4.1.1.2 Photomasks; 4.1.1.3 Photoresists; 4.1.1.3.1 Positive resists; 4.1.1.3.2 Negative resists; 4.1.1.4 Resist application; 4.1.1.5 Alignment and exposure
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4.1.1.5.1 Contact/proximity lithography4.1.1.5.2 Projection lithography; 4.1.1.5.3 Double-sided alignment; 4.1.2 Additive techniques; 4.1.2.1 Spin coating; 4.1.2.2 Thermal oxidation; 4.1.2.3 Physical vapor deposition; 4.1.2.3.1 Evaporation; 4.1.2.3.2 Sputtering; 4.1.2.4 Chemical vapor deposition; 4.1.2.4.1 Low-pressure CVD; 4.1.2.4.2 Plasma-enhanced CVD; 4.1.2.4.3 Atomic layer deposition; 4.1.2.5 Electrochemical deposition; 4.1.3 Subtractive techniques; 4.1.3.1 Wet etching; 4.1.3.1.1 Isotropic wet etching; 4.1.3.1.2 Anisotropic wet etching; 4.1.3.1.3 Metal-assisted chemical etching
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4.1.3.2 Dry etching4.1.3.2.1 Ion-beam etching (ion milling); 4.1.3.2.2 Reactive ion etching; 4.1.3.2.3 Deep reactive ion etching; 4.1.3.2.4 Dry etching masks; 4.1.4 Lift-off; 4.1.5 Bonding; 4.1.5.1 Fusion (direct) bonding; 4.1.5.2 Anodic bonding; 4.1.5.3 Eutectic bonding; 4.1.5.4 Adhesive bonding; 4.2 Advanced patterning techniques; 4.2.1 Remarks on nanoscale patterning; 4.2.2 Electron beam lithography; 4.2.3 Focused ion-beam lithography; 4.2.4 Nanoimprint lithography; 4.2.5 Soft lithography; 4.2.5.1 Microcontact printing; 4.2.5.2 Micromolding and replica; 4.2.5.2.1 Replica molding
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4.2.5.2.2 Micromolding in capillaries
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English
Weitere Ausg.:
ISBN 1-4557-3141-2
Sprache:
Englisch
