UID:
almahu_9948025806202882
Umfang:
1 online resource (553 p.)
ISBN:
1-282-01355-6
,
9786612013553
,
0-08-094704-2
,
0-8155-1647-9
Serie:
Materials and Processes for Electronic Applications
Inhalt:
This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a
Anmerkung:
Includes index.
,
Front Cover; Coating Materials for Electronic Applications: Polymers, Processes, Reliability, Testing; Copyright Page; Table of Contents; Chapter 1. Functions and Requirements of Coatings for Electronic Applications; 1.1 FUNCTIONS AND REQUIREMENTS; 1.2 ENVIRONMENTAL PROTECTION FUNCTIONS; 1.3 SPECIAL METAL PROTECTION; 1.4 ELECTRICAL FUNCTIONS; 1.5 THERMAL FUNCTIONS; REFERENCES; Chapter 2. Chemistry and Properties of Polymer Coatings; 2.1 ACRYLICS; 2.2 POLYESTERS; 2.3 POLYVINYLS; 2.4 POLYSTYRENES; 2.5 DIALLYLPHTHALATE AND OTHER ALLYLIC POLYMERS; 2.6 EPOXIES; 2.7 POLYURETHANES; 2.8 SILICONES
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2.9 POLYIMIDES2.10 P-POLYXYLYLENES (PARYLENES); 2.11 BENZOCYCLOBUTENE, CYCLOTENE®; 2.12 FLUOROCARBONS AND FLUORINATED POLYMERS; 2.13 POLYSULFONES; 2.14 POLYARYLETHERETHERKETONE, PEEK; 2.15 POLYAMIDES; 2.16 PHENOLICS; 2.17 POLYSULFIDES; REFERENCES; Chapter 3. Manufacturing Technology; 3.1 MASKING; 3.2 CLEANING; 3.3 SURFACE PREPARATION; 3.4 COATING PREPARATION; 3.5 APPLICATION METHODS; 3.6 CURING AND POLYMERIZATION PROCESSES; 3.7 MANUFACTURING ISSUES; REFERENCES; Chapter 4. Applications; 4.1 CONFORMAL COATINGS FOR PRINTED WIRING ASSEMBLIES (PWA)
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4.2 COATINGS FOR SEMICONDUCTOR SINGLE CHIP AND MULTICHIP MODULES4.3 COATINGS FOR DISCRETE PASSIVE DEVICES; 4.4 MULTILAYER CIRCUIT BOARD FABRICATION; 4.5 INTERLAYER DIELECTRIC COATINGS FOR MULTICHIP MODULE SUBSTRATES; 4.6 POLYMER WAVEGUIDES; 4.7 SOLDER MASKANTS; 4.8 CHIP-SCALE AND BALL GRID ARRAY PACKAGES; 4.9 CHIP-ON-BOARD (COB) AND GLOB-TOP COATINGS; 4.10 PARTICLE IMMOBILIZING COATINGS AND PARTICLE GETTERS; 4.11 REINFORCEMENT OF INTERCONNECTIONS; 4.12 WIRE AND COIL COATINGS; 4.13 COATINGS FOR SPACE APPLICATIONS; 4.14 COATINGS FOR AUTOMOTIVE APPLICATIONS
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4.15 COATINGS FOR ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING AND ELECTROSTATIC DISCHARGE (ESD)4.16 COATINGS FOR MEDICAL APPLICATIONS; 4.17 TAMPER-PROOF COATINGS; 4.18 TEMPORARY COATINGS; 4.19 POLYMER THICK FILMS; REFERENCES; Chapter 5. Reliability Assurance and Testing; 5.1 INITIAL QUALIFICATION; 5.2 RECEIVING INSPECTION; 5.3 IN-PROCESS INSPECTION AND TESTING; 5.4 FINAL INSPECTION AND TEST; 5.5 RELIABILITY PREDICTION; 5.6 FAILURE MODES AND MECHANISMS; 5.7 TEST PROCEDURES FOR CONTAMINANTS AND CLEANLINESS ASSURANCE; 5.8 ACCELERATED STRESS AND ENVIRONMENTAL TESTS
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5.9 TESTS FOR COATING INTEGRITY5.10 ADHESION; REFERENCES; Chapter 6. Test Methods; 6.1 PHYSICAL/MECHANICAL TEST METHODS; 6.2 ELECTRICAL TESTS; 6.3 ENVIRONMENTAL EXPOSURE TESTS; 6.4 THERMAL TESTS; 6.5 CHEMICAL/ANALYTICAL TESTS; REFERENCES; Chapter 7. Specifications and Documents; 7.1 TOP-LEVEL PERFORMANCE OR REQUIREMENTS SPECIFICATION; 7.2 MATERIAL SPECIFICATIONS; 7.3 PROCESS SPECIFICATIONS; 7.4 WORK INSTRUCTIONS; 7.5 FAILURE ANALYSIS DOCUMENTATION; 7.6 MILITARY, SPACE, GOVERNMENT. AND INDUSTRY SPECIFICATIONS; 7.7 SPECIFICATIONS RELATING TO ORGANIC COATINGS; Appendix; Index
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English
Weitere Ausg.:
ISBN 0-8155-1492-1
Sprache:
Englisch
