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    Online Resource
    Online Resource
    Berlin, Heidelberg :Springer Berlin Heidelberg :
    UID:
    almahu_9949199025902882
    Format: VII, 197 p. 48 illus. , online resource.
    Edition: 1st ed. 1989.
    ISBN: 9783540460107
    Series Statement: Advances in Polymer Science, 88
    Note: Epoxy molding compounds as encapsulation materials for microelectronic devices -- Synthesis and structure of macromolecular topological compounds -- Reactions and photodynamics in polymer solids -- Thermotropic mesophases in element-organic polymers.
    In: Springer Nature eBook
    Additional Edition: Printed edition: ISBN 9783662150818
    Additional Edition: Printed edition: ISBN 9783662150801
    Additional Edition: Printed edition: ISBN 9783540504726
    Language: English
    Library Location Call Number Volume/Issue/Year Availability
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