UID:
almafu_9960101854002883
Format:
1 online resource
Edition:
1st edition.
ISBN:
9781119418344
,
1119418348
,
9781119418337
,
111941833X
,
9781119418320
,
1119418321
Content:
"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"--
Additional Edition:
Print version: Tu, K. N. 1937- Electronic packaging science and technology Hoboken, NJ : Wiley, 2022 ISBN 9781119418313
Language:
English
Keywords:
Electronic books.
;
Electronic books.
;
Electronic books.
DOI:
10.1002/9781119418344
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344
