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    UID:
    b3kat_BV045148996
    Format: 1 Online-Ressource (X, 192 p)
    ISBN: 9781475731590
    Content: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- 〈LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics
    Additional Edition: Erscheint auch als Druck-Ausgabe ISBN 9781441948731
    Language: English
    Keywords: Mikroelektronik ; Simulation ; Konferenzschrift ; Konferenzschrift
    URL: Volltext  (URL des Erstveröffentlichers)
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