UID:
almafu_9960011197802883
Format:
1 online resource (712 p.)
ISBN:
3-03826-780-5
Series Statement:
Materials Science Forum, Volume 815
Content:
Collection of selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China. The 127 papers are grouped as follows: Symposium E: Materials in Microelectronic and Optoelectronic Industry; Symposium G: Multiferroic Materials; Symposium H: Smart Materials; Symposium I: Vanadium-Titanium And Rare Earth Functional Materials; Symposium J: Biomedical Materials; Symposium K: High Performance And Functional Polymer and Composite Materials
Note:
Description based upon print version of record.
,
Advanced Functional Materials; Preface; Table of Contents; Symposium E: Materials in Microelectronic and Optoelectronic Industry; Process Control of Buried Layer Epitaxy by Barrel Type Furnace; Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing; Research on Surface Roughness of Acid Etched Silicon Wafers; Investigation of Chemical Vapor Deposited Graphene Film on Oxide Substrate; Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects; Property of an AlGaN/GaN MIS Diode with Si3N4/Al2O3 Bilayer Gate Dielectric Films
,
A New Type of Self-Aligned Technology for RF and Microwave Graphene Field-Effect TransistorsElectron Beam Annealing for Component Optimization in Si-Sb-Te Material; Structures and Electronic Properties of a Si55 Cluster on DFTB Calculations; Surface Plasmon Enhanced Photoluminescence of the Rubrene Film by Silver Nanoparticles; Development of Precious Metal and its Alloy Sputtering Targets with High Performance; Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites; Study of Black Center in Silicon Wafer for Solar Cell
,
Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu SubstrateEffect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder; Influence of Dislocation Density on Micromechanical Characteristics of Cu6Sn5 and Cu3Sn; Microstructure and Dielectric Properties of (Ba, Ta) Co-Doped Sr2Nb2O7 Ceramics; Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate
,
Ferroelectric and Photovoltaic Properties of Mn-Doped Bismuth Ferrite Thin FilmsMagnetic Properties and Unusual Morphologies of Barium Ferrites Prepared by Electrospinning and Sol-Gel Auto-Combustion Method; Symposium G: Multiferroic Materials; Effects of Sm and Mn Co-Doping on Structural and Optical Properties of BiFeO3 Thin Films Prepared by Sol-Gel Technique; Effects of Ba and Ti Codoping on Stoichiometric and Nonstoichiometric BiFeO3 Multiferroic Ceramics; A Review on the Characteristics of the New Multiferroic Three-Ply Structure Ferroelectric-Ferromagnetic Nanocomposite
,
Preparation of LSMO/PLZT Composite Film by Sol-Gel Technique and its Ferroelectric and Ferromagnetic Properties
,
English
Additional Edition:
ISBN 3-03835-394-9
Language:
English
