Format:
Online-Ressource (208 p)
ISBN:
9781439862056
,
9781283274609
,
1283274604
,
9781439862070
Content:
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performan
Note:
Description based upon print version of record
,
Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover
Additional Edition:
ISBN 9781439862070
Additional Edition:
ISBN 9781439862056
Additional Edition:
Erscheint auch als Druck-Ausgabe Semiconductor Packaging : Materials Interaction and Reliability
Additional Edition:
Erscheint auch als Druck-Ausgabe Chen, Andrea Semiconductor packaging Boca Raton, Fla. [u.a.] : CRC Press, 2012 ISBN 9781439862056
Language:
English
Subjects:
Engineering
Keywords:
Integrierte Schaltung
;
Gehäuse
;
Electronic books
URL:
Volltext
(lizenzpflichtig)
