UID:
almafu_9959328791702883
Format:
1 online resource :
,
illustrations
ISBN:
9780470310519
,
0470310510
,
9780470374825
,
0470374829
Series Statement:
Ceramic engineering and science proceedings, v. 9, no. 11-12
Note:
Multichip module technology / D.R. Barbour -- Low dielectric constant, alumina-compatible, co-fired multilayer substrate / Douglas M. Mattox, Stephen R. Gurkovich, John A. Olenick, Keith M. Mason -- Filling the gap between thick and thin film / R.A. Rinne, H.L. Fritz -- Electrical, mechanical, and thermal characterization of a cofired, multilayer substrate processed from sol-gel silica / L.E. Sanchez -- Materials compatibility and co-sintering aspects in low temperature co-fired ceramic packages / Howard T. Sawhill -- Advantages of co-fired multilayer over thick film technology / K.K. Verma.
Additional Edition:
Print version: Conference on Cofire Technology (1987 : San Diego, Calif.). Cofire technology. Westerville, OH : American Ceramic Society, ©1988
Language:
English
Keywords:
Electronic books.
;
Conference papers and proceedings.
;
Electronic books.
;
Conference papers and proceedings.
;
Electronic books.
;
Conference papers and proceedings.
DOI:
10.1002/9780470310519
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/9780470310519
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/9780470310519
URL:
https://onlinelibrary.wiley.com/doi/book/10.1002/9780470310519