Kooperativer Bibliotheksverbund

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Format: 1 online resource (488 p.)

Edition: 1st edition

ISBN: 1-282-12109-X , 9786612121098 , 0-08-094354-3

Content: This book provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Editor. Capture is used to build the schematic diagram of the circuit, and Editor is used to design the circuit board so that it can be manufactured. The book is written for both students and practicing engineers who need in-depth instruction on how to use the software, and who need background knowledge of the PCB design process. KEY FEATURES:* Beginning to end cove

Note: Description based upon print version of record. , FRONT COVER; COMPLETE PCB DESIGN USING ORCAD® CAPTURE AND PCB EDITOR; COPYRIGHT PAGE; CONTENTS; INTRODUCTION; ACKNOWLEDGMENTS; CHAPTER 1 Introduction to PCB Design and CAD; Computer-Aided Design and the OrCAD Design Suite; Printed Circuit Board Fabrication; PCB Cores and Layer Stack-Up; PCB Fabrication Process; Photolithography and Chemical Etching; Mechanical Milling; Layer Registration; Function of OrCAD PCB Editor in the PCB Design Process; Design Files Created by PCB Editor; PCB Editor Format Files; Artwork (Gerber) Files; PCB Assembly Layers and Files , CHAPTER 2 Introduction to the PCB Design Flow by ExampleOverview of the Design Flow; Creating a Circuit Design with Capture; Designing the PCB with PCB Editor; The PCB Editor Window; Drawing the Board Outline; Placing Parts; Moving and Rotating Parts; Routing the Board; Creating Artwork for Manufacturing; CHAPTER 3 Project Structures and the PCB Editor Tool Set; Project Setup and Schematic Entry Details; Capture Projects Explained; Capture Part Libraries Explained; Understanding the PCB Editor Environment and Tool Set; Terminology; PCB Editor Windows and Tools; The Design Window , The Toolbar GroupsControl Panel with Foldable Window Panes; Command Window Pane; WorldView Window Pane; Status Bar; Color and Visibility Dialog Box; Layout Cross Section (Layer Stack-Up) Dialog Box; Constraint Manager; Manufacturing Artwork and Drill Files; Understanding the Documentation Files; CHAPTER 4 Introduction to Industry Standards; Introduction to the Standards Organizations; Institute for Printed Circuits (IPC-Association Connecting Electronics Industries); Electronic Industries Alliance (EIA); Joint Electron Device Engineering Council (JEDEC) , International Engineering Consortium (IEC)Military Standards; American National Standards Institute (ANSI); Institute of Electrical and Electronics Engineers (IEEE); Classes and Types of PCBs; Performance Classes; Producibility Levels; Fabrication Types and Assembly Subclasses; IPC Land Pattern Density Levels; Introduction to Standard Fabrication Allowances; Registration Tolerances; Breakout and Annular Ring Control; PCB Dimensions and Tolerances; Standard Panel Sizes; Tooling Area Allowances and Effective Panel Usage; Standard Finished PCB Thickness; Core Thickness; Prepreg Thickness , Copper Thickness for PTHs and ViasCopper Cladding/Foil Thickness; Copper Trace and Etching Tolerances; Standard Hole Dimensions; Soldermask Tolerance; References; Suggested Reading; Other Items of Interest; CHAPTER 5 Introduction to Design for Manufacturing; Introduction to PCB Assembly and Soldering Processes; Assembly Processes; Soldering Processes; Component Placement and Orientation Guide; Component Spacing for Through-Hole Devices; Component Spacing for Surface-Mounted Devices; Mixed THD and SMD Spacing Requirements; Footprint and Padstack Design for PCB Manufacturability , Land Patterns for Surface-Mounted Devices , English

Additional Edition: ISBN 0-7506-8971-4

Language: English