UID:
almahu_9949199025902882
Format:
VII, 197 p. 48 illus.
,
online resource.
Edition:
1st ed. 1989.
ISBN:
9783540460107
Series Statement:
Advances in Polymer Science, 88
Note:
Epoxy molding compounds as encapsulation materials for microelectronic devices -- Synthesis and structure of macromolecular topological compounds -- Reactions and photodynamics in polymer solids -- Thermotropic mesophases in element-organic polymers.
In:
Springer Nature eBook
Additional Edition:
Printed edition: ISBN 9783662150818
Additional Edition:
Printed edition: ISBN 9783662150801
Additional Edition:
Printed edition: ISBN 9783540504726
Language:
English
URL:
https://doi.org/10.1007/BFb0017962