Format:
Online-Ressource
,
v.: digital
Edition:
Online-Ausg. 2005 Springer eBook Collection. Chemistry and Materials Science
ISBN:
9783540269458
Series Statement:
Microtechnology and MEMS
Content:
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging. TOC:Introduction.- Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusion and Outlook
Additional Edition:
ISBN 9783540221876
Additional Edition:
Erscheint auch als Druck-Ausgabe Schwizer, Jürg, 1973 - Force sensors for microelectronic packaging applications Berlin : Springer, 2005 ISBN 3540221875
Additional Edition:
ISBN 9783540221876
Language:
English
Subjects:
Engineering
Keywords:
Prozessüberwachung
;
Kraftsensor
;
Drahtbonden
;
Flip-Chip-Technologie
URL:
Volltext
(lizenzpflichtig)
Bookmarklink